Deepx's 2nm AI chip dx-m2 set for early 2027 debut, earns ces award

South Korean edge AI chip developer DEEPX announced that its forthcoming DX-M2 chip secured the Innovation Award in the Artificial Intelligence category at CES 2027. The company confirmed that the first batch of these chips is anticipated to become available in early 2027, following the successful completion of the photolithography process. The DX-M2 is engineered using Samsung's 2nm fabrication process and features an 80TOPs NPU. It supports up to 128-bit LPDDR5X-9600 memory, enabling the local execution of Large Language Models (LLMs) and Vision-Language Models (VLMs) with over 10 billion parameters, all while maintaining a low power consumption of just 5W. DEEPX also indicated that a version of the DX-M2 incorporating integrated memory will be offered alongside the standalone chip.