Frore launches liquidjet diamond: diamond-integrated heat spreader boosts cooling efficiency

Frore Systems unveiled the LiquidJet Diamond on October 9, 2026, introducing a new cooling solution that builds on its existing LiquidJet 3D short-loop multi-stage customizable cold plate. The product features an integrated diamond wafer heat spreader, enabling precise coverage of hotspots. Frore claims the LiquidJet Diamond can cool power densities up to 770 W/cm², achieving a 10°C reduction in GPU hotspot temperatures and a 10% improvement in energy efficiency compared to LiquidJet. The company previously showcased LiquidJet's capabilities in cooling high thermal loads, including suppressing 1950W temperatures for NVIDIA Rubin GPUs and enhancing heat exchange efficiency by 75% in its 0.5U LiquidJet Nexus system. These advancements highlight Frore's ongoing efforts to push the boundaries of liquid cooling technology for AI and high-performance computing applications.