Houmo.AI announces next-gen AI chip architecture for edge devices

Houmo.AI confirmed at the 2026 Global AI Chip Summit that its next-generation large model edge AI chip will adopt a 3D CIM architecture, integrating memory and computation with 3D DRAM technology. This new flagship chip is expected to deliver twice the computing power in the same area, while also improving power efficiency and thermal management. IT Home noted that Houmo.AI launched the Houmo Manjie M50 chip in July 2025, which offers 160TOPS (INT8) or 100TFLOPS (bFP16) performance, 48GB memory, and 153.6GB/s bandwidth. The chip has secured over 150 product orders across various applications. Additionally, Zero-Knot introduced the SEi13 AI and SEi14 AI mini PCs, featuring up to 160TOPS independent NPU, starting at 11,895 yuan.