TSMC Advances Chip Production Timeline to Meet AI Chip Demand from Nvidia and AMD

Nvidia, AMD, and Broadcom have driven TSMC to accelerate its semiconductor production schedule significantly. The Taiwan-based manufacturer now expects to reach 180,000 monthly 3nm wafer starts in early Q4 2026, two to three months ahead of its original year-end target. The company is similarly accelerating its 2nm process deployment, projecting 100,000 monthly wafer starts by end of 2026. To support this expansion, TSMC has announced three new 3nm fabrication plants and is repurposing 5nm equipment in Taiwan for 3nm production. For next-generation technology, TSMC is constructing dedicated 1.4nm fabs at the Zhongke II complex, expected to complete in April 2027. The new process node offers 20-23% higher transistor density and 10-15% performance improvement compared to 2nm.