Xiaomi unveils new AI chips and prototype devices with advanced computing capabilities

Xiaomi’s founder, Lei Jun, announced two prototype devices equipped with the new Xuanjie chip, highlighting advancements in AI computing. The first device, the Xuanjie O100 prototype, is designed as a high-speed AI demonstration terminal. It features dual-core Xuanjie O3 and O100 chips, with a completely redesigned motherboard that removes traditional phone imaging modules. The device includes an active cooling system capable of handling up to 10 watts of power, and it runs Xiaomi MiMo models, achieving a processing speed of 295 tokens per second. The second prototype, the Xiaomi AI Cube, is built with an aerospace-grade aluminum body and features 33,874 CNC precision ventilation holes. It supports continuous performance output of up to 150 watts and integrates Xuanjie O3, O100, and D100 chips. The device includes 80GB of unified memory and can run both a 120B large model and a 3B model for edge computing. It allows for fast switching between different system modes, enabling efficient execution of both front-end development and complex programming tasks. According to the plan, the Xuanjie O3 chip will be used in the Xiaomi 18 Fold, while the other two chips are set for commercial release in 2027. The Xiaomi AI Cube engineering version was also officially announced, featuring the trio of Xuanjie chips and sustained high-performance output.